Small Etching Device for Research and Development HPE40
Compact etching machine that is suitable for narrow spaces, allows for customizable settings based on usage, and achieves short delivery times.
【Process】Input → Etching → Liquid Drain → Rinse 1 → Rinse 2 → Squeeze → Extraction 【Board Size】Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1420 × L1950 × H1645 mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCB and LCD
